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Polishing Slurry

TRUSTWELL
TSW series slurry

As well as the diamond slurry, TRUSTWELL offer slurries produced from general abrasives as main component for lap and polish for metal and brittle materials

TRUSTWELL TSW series slurry
PRODUCT NAME CHARACTERISTICS SOLUTION AVERAGE PARTICLE SIZE(μm)
TSW-100 TSO-100
Diamond Slurry
Lubricant
Composed of strictly classified multiple or single crystal
diamond powder. Can be used to polish brittle material to achieve ultra-smooth surface, and be adjusted several kind of concentration for adapting customer’s applications.
Water-based
Oil-based
Paste type
0.05 / 0.08 / 0.1 / 0.5 / 1.0 / 2.0 / 2.5 / 3.0 / 5.0 / etc
TSW-200 TSO-200
Alumina Oxide Slurry
Composed of high purity aluminum oxide for polishing metal, hard glass, and composed semiconductor materials
Well balanced polishing efficiency, polishing speed, and easy removal from polishing particles.
Water-based
Oil-based
Paste type
0.1 / 0.2 / 0.5 / 0.7 / 0.8 /
1.0 / 1.2 / 2.0 / 3.0 / etc
TSW-300
Cerium Oxide Slurry
Mainly composed of high purity cerium oxide and well balanced polishing efficiency, surface quality, and easy removal from polishing particles.
Well dispersed and suitable for polishing glass materials.
Water-based 0.8〜3.0(micron)
TSW-500
Chromium Oxide Slurry
Composed of high purity chromium oxide for polishing silicon wafers, sapphire wafers, and others. Water-based 1.0

Diamond Paste

TRUSTWELL diamond paste TP series, you can choose the proper sizes in two types of abrasive grains, polycrystalline and single crystal diamond. Solvents also are available two types of oil and water-base.

TPシリーズダイヤモンドペースト

FEATIRES

  • Using precise classified TMD series diamond
  • Well dispersed and high removal rate
  • Concentration and viscosity are adjusted to grain size
Size Average size
1/2 0-1 0.60
1.0 0-2 1.00
3.0 2-4 3.00
4.0 2-6 4.20
6.0 4-8 6.30
9.0 6-12 9.00
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