As well as the diamond slurry, TRUSTWELL offer slurries produced from general abrasives as main component for lap and polish for metal and brittle materials
|PRODUCT NAME||CHARACTERISTICS||SOLUTION||AVERAGE PARTICLE SIZE(μm)|
|TSW-100 TSO-100||Composed of strictly classified multiple or single crystal
diamond powder. Can be used to polish brittle material to achieve ultra-smooth surface, and be adjusted several kind of concentration for adapting customer’s applications.
|0.05 / 0.08 / 0.1 / 0.5 / 1.0 / 2.0 / 2.5 / 3.0 / 5.0 / etc|
|TSW-200 TSO-200||Composed of high purity aluminum oxide for polishing metal, hard glass, and composed semiconductor materials
Well balanced polishing efficiency, polishing speed, and easy removal from polishing particles.
|0.1 / 0.2 / 0.5 / 0.7 / 0.8 /
1.0 / 1.2 / 2.0 / 3.0 / etc
|Alumina Oxide Slurry|
|TSW-300||Mainly composed of high purity cerium oxide and well balanced polishing efficiency, surface quality, and easy removal from polishing particles.
Well dispersed and suitable for polishing glass materials.
|Cerium Oxide Slurry|
|TSW-500 TSO-500||Composed of high purity chromium oxide for polishing silicon wafers, sapphire wafers, and others.||Water-based||1.0|
|Chromium Oxide Slurry|
TRUSTWELL diamond paste TP series, you can choose the proper sizes in two types of abrasive grains, polycrystalline and single crystal diamond. Solvents also are available two types of oil and water-base.