TRUSTWELL multi-wire saw uses the well-electroplated diamond saw.
Electroplated diamond saw, compared to traditional methods of free abrasives which use slurry improves process yield, by reducing the processing time for slicing, spacing, and residual strain of the waste heat recovery power generation material and brittle materials
such as sapphire or SiC. Because of using a water base cutting fluid, OTW series, recovery and recycling sludge can be colected. Low operating costs of OTW achieves revolutionary environmentally friendly.
|Maximum work size||Ｄ：90ｍｍ Ｌ：100ｍｍ|
|Wire feed method||Reciprocating motion|
|Wire diameter||0.12〜0.26 mm|
|Wire feed speed||30〜100m/min|
|Cutting feed speed||0.1〜5mm/min|
|Fast feed/back feed speed||150mm/min|
|Maximum wire amount of preparation||3000m(D:0.26mm)|
CVP21 can analysis various wafer quality such as doping, uniContactity of
doping,and surface quality precisely by etching the small area on wafers.
By switching to mercury lamps and halogen lamps with smart and dedicated software, a wide band-gap corresponds to. Moreover without any hardware calibration, a wide range of up to 1×10¹²/cm³ ～ 1×10²¹/cm³ can be analysed.
Laser scanning Imager is the new observation device which conquered the weakness of the conventional microscope such as the CCD camera and the linear sensor.
Unprecedented wide area are scanned at high speed together while applying a laser to the measurement surface vertically. (Example: 60mm width) The extremely large field of view can be acquired at high speed compared with general microscope.
(Example: 0.2 μm of resolution at 4mm width scan) moreover a sharp contrast and also convenient for observation of transparent material by the confocal system.